Micromachined or microelectromechanical systems or microsystems are microdevices or systems that can be mass-produced, integrate micromechanisms, microsensors, microactuators, and signal processing and control circuits, even peripheral interfaces, communication circuits, and power supplies. . Its main features are: small size (feature size range: 1μm-10mm), light weight, low energy consumption, stable performance; is conducive to mass production, reduce production costs; small inertia, high resonant frequency, short response time; intensive High-tech achievements, high added value. The purpose of micro-mechanics is not only to reduce the size and volume, but also aims to develop a new technology field and form a mass industry through miniaturization, integration, search for new principles, new functional components and systems.
Micro-machining technology refers to microfabrication technology that is made into a mechanical device. The appearance and development of micro-fabrication is closely related to large-scale integrated circuits. Integrated circuits require more electronic components to be contained in a small-area semiconductor to form a circuit with complicated functions. The minimum line width in circuit fine patterns is a key technical sign to improve integrated circuit integration. Micro-machining is a kind of advanced micro-nano-scale fabrication of micro-size components or thin-patterns for the microelectronics industry. Manufacturing Technology. Microfabrication technology is mainly based on the silicon plane processing and body processing technology developed from the microfabrication technology of semiconductor integrated circuits. After the mid-1980s, LIGA processing (micro-mold electroplating process), quasi-LIGA processing, ultra-fine processing Major advances have been made in micromachining processes such as micro-discharge machining (EDM), plasma beam machining, electron beam machining, rapid prototyping (RPM), and bonding technologies.
Micro-mechanical systems can accomplish tasks that large-scale electromechanical systems cannot accomplish. The close integration of micro-mechanics and electronic technologies will enable the availability of a wide range of micro-devices, which will be manufactured in high-volume integrated and low-cost, and will be widely used in many fields of human life. It can be expected that in this century, micro-machinery will gradually move from the laboratory to application, and will have a major impact on the development of industries such as industry, agriculture, information, environment, biomedicine, space, and national defense. Micro-mechanical processing technology is a very important and very active technology field in the field of micro-mechanics technology. Its development can not only promote the development of many related disciplines, but also is closely related to national science and technology development, economic and national defense construction. The development of micro-machining technology has huge industrial application prospects.
In 1959, Richard Pfeiynman (Nobel Prize-winning physics in 1965) proposed the concept of micro-machinery. In 1962, the first micro-silicon pressure sensor was introduced, and the micro-mechanics of gears, gear pumps, pneumatic turbines, and couplings with dimensions of 50 to 500 μm were developed. In 1965, Stanford University developed a silicon brain electrode probe, and later succeeded in scanning tunneling microscopes and micro sensors. In 1987, the University of California, Berkeley developed a silicon micro-electrostatic machine with a rotor diameter of 60 to 12 μm, showing the potential of using a silicon micro-machining process to fabricate small movable structures and to be compatible with integrated circuits to create tiny systems.
Micro-machinery has been highly valued by government agencies, business circles, universities and research institutes abroad. MIT, Berkeley, Stanford, AT&T, and 15 scientists proposed a "National Small Machinery, Big Opportunity: Report on Emerging Fields - Microkinetics Report" at the end of the 1980s, claiming that "because of microkinetics The urgency of (microsystems) in the United States should go ahead in competition with other countries in such a new and important technology area." It is recommended that the center's financial advance payment be five years worth 50 million U.S. dollars. Investing, and taking aerospace, information, and MEMS as the three major focuses of technological development. NASA invested $100 million in the development of the "Discovery Microsatellite". The National Science Foundation has developed MEMS as a newly emerging research area to fund the research of microelectronic mechanical systems. It has been funding MIT since 1998. Eight universities such as the University of California and Bell Laboratories are engaged in research and development in this area. The annual funding has increased from 1 million to 2 million to 5 million U.S. dollars in 1993. The "US Department of Defense Technology Plan" report released in 1994 listed MEMS as a key technology project. The U.S. Department of Defense’s Advanced Research Projects Agency actively leads and supports MEMS research and military applications. A MEMS standard process line has now been established to promote the research and development of new types of components/devices.
U.S. industry is focused on the research of sensors, displacement sensors, strain gauges, and accelerometers. Many institutions have participated in the research of micro-mechanical systems, such as Cornell University, Stanford University, University of California, Berkeley, University of Michigan, University of Wisconsin, and Old Reynoldsmore National Research. The University of California, Berkeley Sensors and Actuators Center (BSAC) received funding of 15 million yuan from the Department of Defense and more than a dozen companies, and established a 1115m2 laboratory for research and development of MEMS cleanrooms.
In 1997, Japan’s Ministry of International Trade and Industry began a 10-year, 25-billion-yen micro-scale large-scale research project to develop two prototypes, one for medical treatment, diagnosis and microsurgery into the human body, and the other for industrial use. , Maintenance of micro cracks in aircraft engines and atomic energy equipment. The plan includes dozens of companies including Tsukuba University, Tokyo Institute of Technology, Tohoku University, Waseda University, and the Fujitsu Institute.
Industrialized countries in Europe have also successively invested in the research and development of microsystems. Since 1988, Germany has begun a microprocessing 10-year plan project. Its Ministry of Science and Technology allocated 40,000 marks in 1990-1993 to support the study of the “Microsystems Program†and The microsystems have been listed as the focus of the development of science and technology at the beginning of this century. The LIGA process pioneered by Germany has provided new technological means for the development of MEMS and has become the preferred process for the production of three-dimensional structures. France's 70 million francs "Microsystems and Technology" project launched in 1993. The European Community formed the "Multifunctional Microsystems Research Network NEXUS" and coordinated the research of 46 institutes. Switzerland also invested in MEMS development on the basis of its traditional watch manufacturing industry and small precision machinery industry. In 1992, it invested 10 million US dollars. The British government has also formulated a nanoscience program. Eight projects have been listed for research and development in the fields of mechanics, optics and electronics. In order to strengthen the development of MEMS in Europe, some European companies have formed MEMS development group.
A large number of micro-mechanics or micro-systems have been studied. For example, a miniature tweezers with a tip diameter of 5 μm can hold a red blood cell and a micro-pump with a size of 7 mm×7 mm×2 mm can flow to a car that can start up to 250 μl/min. The machine butterfly that flies in the magnetic field, as well as the miniature inertial assembly (MIMU) that integrates the micro-velocity meter, the miniature gyro and the signal processing system. Germany created the LIGA process and made cantilever beams, actuators, and micropumps, micro-nozzles, humidity, flow sensors, and a variety of optics. Caltech in the United States adhered a considerable amount of 1mm microbeams to the wing surface of aircraft to control its bending angle to influence the aerodynamics of the aircraft. The mass-produced silicon accelerometer in the United States integrates microsensors (mechanical parts) and integrated circuits (electrical signal sources, amplifiers, signal processing, positive detection circuits, etc.) on a silicon chip in a 3 mm×3 mm range. Developed in Japan, quasi-descendant Chennai (12), the Department of Consolidation, Sugiyuki Machi, is a 5μm micro shaft.
Micro-machining technology refers to microfabrication technology that is made into a mechanical device. The appearance and development of micro-fabrication is closely related to large-scale integrated circuits. Integrated circuits require more electronic components to be contained in a small-area semiconductor to form a circuit with complicated functions. The minimum line width in circuit fine patterns is a key technical sign to improve integrated circuit integration. Micro-machining is a kind of advanced micro-nano-scale fabrication of micro-size components or thin-patterns for the microelectronics industry. Manufacturing Technology. Microfabrication technology is mainly based on the silicon plane processing and body processing technology developed from the microfabrication technology of semiconductor integrated circuits. After the mid-1980s, LIGA processing (micro-mold electroplating process), quasi-LIGA processing, ultra-fine processing Major advances have been made in micromachining processes such as micro-discharge machining (EDM), plasma beam machining, electron beam machining, rapid prototyping (RPM), and bonding technologies.
Micro-mechanical systems can accomplish tasks that large-scale electromechanical systems cannot accomplish. The close integration of micro-mechanics and electronic technologies will enable the availability of a wide range of micro-devices, which will be manufactured in high-volume integrated and low-cost, and will be widely used in many fields of human life. It can be expected that in this century, micro-machinery will gradually move from the laboratory to application, and will have a major impact on the development of industries such as industry, agriculture, information, environment, biomedicine, space, and national defense. Micro-mechanical processing technology is a very important and very active technology field in the field of micro-mechanics technology. Its development can not only promote the development of many related disciplines, but also is closely related to national science and technology development, economic and national defense construction. The development of micro-machining technology has huge industrial application prospects.
In 1959, Richard Pfeiynman (Nobel Prize-winning physics in 1965) proposed the concept of micro-machinery. In 1962, the first micro-silicon pressure sensor was introduced, and the micro-mechanics of gears, gear pumps, pneumatic turbines, and couplings with dimensions of 50 to 500 μm were developed. In 1965, Stanford University developed a silicon brain electrode probe, and later succeeded in scanning tunneling microscopes and micro sensors. In 1987, the University of California, Berkeley developed a silicon micro-electrostatic machine with a rotor diameter of 60 to 12 μm, showing the potential of using a silicon micro-machining process to fabricate small movable structures and to be compatible with integrated circuits to create tiny systems.
Micro-machinery has been highly valued by government agencies, business circles, universities and research institutes abroad. MIT, Berkeley, Stanford, AT&T, and 15 scientists proposed a "National Small Machinery, Big Opportunity: Report on Emerging Fields - Microkinetics Report" at the end of the 1980s, claiming that "because of microkinetics The urgency of (microsystems) in the United States should go ahead in competition with other countries in such a new and important technology area." It is recommended that the center's financial advance payment be five years worth 50 million U.S. dollars. Investing, and taking aerospace, information, and MEMS as the three major focuses of technological development. NASA invested $100 million in the development of the "Discovery Microsatellite". The National Science Foundation has developed MEMS as a newly emerging research area to fund the research of microelectronic mechanical systems. It has been funding MIT since 1998. Eight universities such as the University of California and Bell Laboratories are engaged in research and development in this area. The annual funding has increased from 1 million to 2 million to 5 million U.S. dollars in 1993. The "US Department of Defense Technology Plan" report released in 1994 listed MEMS as a key technology project. The U.S. Department of Defense’s Advanced Research Projects Agency actively leads and supports MEMS research and military applications. A MEMS standard process line has now been established to promote the research and development of new types of components/devices.
U.S. industry is focused on the research of sensors, displacement sensors, strain gauges, and accelerometers. Many institutions have participated in the research of micro-mechanical systems, such as Cornell University, Stanford University, University of California, Berkeley, University of Michigan, University of Wisconsin, and Old Reynoldsmore National Research. The University of California, Berkeley Sensors and Actuators Center (BSAC) received funding of 15 million yuan from the Department of Defense and more than a dozen companies, and established a 1115m2 laboratory for research and development of MEMS cleanrooms.
In 1997, Japan’s Ministry of International Trade and Industry began a 10-year, 25-billion-yen micro-scale large-scale research project to develop two prototypes, one for medical treatment, diagnosis and microsurgery into the human body, and the other for industrial use. , Maintenance of micro cracks in aircraft engines and atomic energy equipment. The plan includes dozens of companies including Tsukuba University, Tokyo Institute of Technology, Tohoku University, Waseda University, and the Fujitsu Institute.
Industrialized countries in Europe have also successively invested in the research and development of microsystems. Since 1988, Germany has begun a microprocessing 10-year plan project. Its Ministry of Science and Technology allocated 40,000 marks in 1990-1993 to support the study of the “Microsystems Program†and The microsystems have been listed as the focus of the development of science and technology at the beginning of this century. The LIGA process pioneered by Germany has provided new technological means for the development of MEMS and has become the preferred process for the production of three-dimensional structures. France's 70 million francs "Microsystems and Technology" project launched in 1993. The European Community formed the "Multifunctional Microsystems Research Network NEXUS" and coordinated the research of 46 institutes. Switzerland also invested in MEMS development on the basis of its traditional watch manufacturing industry and small precision machinery industry. In 1992, it invested 10 million US dollars. The British government has also formulated a nanoscience program. Eight projects have been listed for research and development in the fields of mechanics, optics and electronics. In order to strengthen the development of MEMS in Europe, some European companies have formed MEMS development group.
A large number of micro-mechanics or micro-systems have been studied. For example, a miniature tweezers with a tip diameter of 5 μm can hold a red blood cell and a micro-pump with a size of 7 mm×7 mm×2 mm can flow to a car that can start up to 250 μl/min. The machine butterfly that flies in the magnetic field, as well as the miniature inertial assembly (MIMU) that integrates the micro-velocity meter, the miniature gyro and the signal processing system. Germany created the LIGA process and made cantilever beams, actuators, and micropumps, micro-nozzles, humidity, flow sensors, and a variety of optics. Caltech in the United States adhered a considerable amount of 1mm microbeams to the wing surface of aircraft to control its bending angle to influence the aerodynamics of the aircraft. The mass-produced silicon accelerometer in the United States integrates microsensors (mechanical parts) and integrated circuits (electrical signal sources, amplifiers, signal processing, positive detection circuits, etc.) on a silicon chip in a 3 mm×3 mm range. Developed in Japan, quasi-descendant Chennai (12), the Department of Consolidation, Sugiyuki Machi, is a 5μm micro shaft.